Touch input device, manufacturing method thereof, and touch detecting method

ABSTRACT

A touch input device including a carrying board, a plurality of first electrode pads, and a plurality of conductive lines is provided. The carrying board includes a plurality of cantilever portions and a plurality of connecting portions. The connecting portions are respectively connected to the cantilever portions. The first electrode pads are respectively disposed on the cantilever portions and configured to sense capacitance variation due to an object approaching or touching the carrying board. The conductive lines extend on the connecting portions and are respectively connected to the first electrode pads. A manufacturing method of a touch input device and a touch sensing method are also provided.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan applicationserial no. 103100397, filed on Jan. 6, 2014. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of this specification.

BACKGROUND OF THE INVENTION

1. Technical Field

The invention relates to an input device, a manufacturing methodthereof, and a detection method. More particularly, the inventionrelates to a touch input device, a manufacturing method thereof, and atouch detecting method.

2. Related Art

With advancements in technology, the input methods for a user ofelectronic devices have evolved from methods such as keyboard input,mouse input, and key input to touch input. Touch input techniquesinclude capacitive touch techniques, resistive touch techniques, andoptical touch techniques. Since the touch input method better matcheshuman intuition,even the eldest or youngest users can achieve goodcommunication with the electronic device through the touch input device.

However, nowadays the touch input devices can only detect the presslocations of the user finger or the stylus, but cannot determine theforce or the depth of the finger or stylus press. Therefore, these touchinput devices are application limited and lack more applicable variety.

On the other hand, the physical keyboards adopted by the desktop andnotebook computers nowadays can only sense which key is pressed by theuser finger, but the keyboards still cannot determine the force pressingdown on the keys. This limits the applicability of the traditionalphysical keyboards.

SUMMARY OF THE INVENTION

The invention provides a touch input device capable of implementing apress sensation.

The invention provides a touch input device capable of sensing a pressdepth during a touch operation.

The invention provides a manufacturing method of a touch input device,in which the method is capable of manufacturing a touch input devicecapable of implementing a press sensation.

The invention provides a touch detecting method capable of detecting apress depth during a touch operation.

In an embodiment of the invention, a touch input device includes acarrying board, a plurality of first electrode pads, and a plurality ofconductive lines. The carrying board has a reference plane and definesan x-coordinate direction and a y-coordinate direction both parallel tothe reference plane and perpendicular to each other. The carrying boardincludes a plurality of cantilever portions and a plurality ofconnecting portions. The connecting portions are respectively connectedto the cantilever portions, so that each of the cantilever portionsindependently sag a distance in a z-coordinate direction relative to thereference plane when pressed by an object, in which the z-coordinatedirection is perpendicular to the x-coordinate direction and they-coordinate direction. The first electrode pads are respectivelydisposed on the cantilever portions. The first electrode pads sense acapacitance variation due to the object approaching or touching thecarrying board in order to determine an x-coordinate value and ay-coordinate value of the object relative to the reference plane. Theconductive lines extend on the connecting portions and are respectivelyconnected to the first electrode pads.

According to an embodiment of the invention, the touch input devicefurther includes a plurality of second electrode pads correspondinglydisposed below the cantilever portions respectively and separated by adistance away from the cantilever portions. When any one of thecantilever portions is pressed by the object and sags towards thecorresponding second electrode pad along the z-coordinate direction, thesecond electrode pad generates a variation in an electrical signal inrespond to the sagging of the corresponding first electrode.

According to an embodiment of the invention, the touch input devicefurther includes a base, in which the carrying board is fixed on thebase. The second electrode pads are disposed on the base to correspondto the first electrode pads, and a separation space or a filling ofinsulated elastic material exists between the first electrode pads andthe corresponding second electrode pads.

According to an embodiment of the invention, the touch input devicefurther includes a first interpretation unit, a second interpretationunit, and a processing unit. The first interpretation unit iselectrically connected to the conductive lines, and the firstinterpretation unit determines a location of the object relative to thereference plane due to the object approaching or touching the carryingboard, and generates a first signal including the x-coordinate value andthe y-coordinate value. The second interpretation unit is electricallyconnected to the second electrode pads, and the second interpretationunit determines a degree of sag of the cantilever portion being pressedby the object, and generates a second signal including the z-coordinatevalue. The processing unit determines a three-dimensional touch locationof the object according to the first signal and the second signal.

According to an embodiment of the invention, the first electrode padsinclude a plurality of transmitting electrode pads and a plurality ofsensing electrode pads alternately arranged on the carrying board andseparated from each other. The conductive lines includes at least onedriving signal line connected to the transmitting electrode pads, and atleast one signal readout line connected to the sensing electrode pads.

In an embodiment of the invention, a touch input device includes aplanar location sensing board, a depth sensing layer, a firstinterpretation unit, a second interpretation unit, and a processingunit. The planar location sensing board senses a first electricalvariation of different locations in the directions parallel to theplanar location sensing board due to an object approaching or touchingthe planar location sensing board. The depth sensing layer is disposedbelow the planar location sensing board and is separated by a distancefrom the planar location sensing board. The depth sensing layer senses asecond electrical variation corresponding to a degree in which theobject presses the planar location sensing board. The firstinterpretation unit is electrically connected to the planar locationsensing board. According to the first electrical variation, the firstinterpretation unit determines the location in the directions parallelto the planar location sensing board which the object approaches ortouches the planar location sensing board, and generates a correspondingfirst signal. The second interpretation unit is electrically connectedto the depth sensing layer, and the second interpretation unitdetermines the degree the object presses the planar location sensingboard according to the second electrical variation, and generates acorresponding second signal. The processing unit determines athree-dimensional touch location of the object according to the firstsignal and the second signal.

In an embodiment of the invention, a manufacturing method of a touchinput device includes: providing a substrate; forming a plurality offirst electrode pads and a plurality of conductive lines on thesubstrate; and performing a substrate patterning process in order topattern a plurality of cantilever portions and a plurality of connectingportions from the substrate, in which the connecting portions areconnected to the cantilever portions.

According to an embodiment of the invention, the step of forming thefirst electrode pads and conductive lines is before the step ofperforming the substrate patterning process. Moreover, after thesubstrate patterning process, the first electrode pads are located onthe cantilever portions, and the conductive lines are formed on theconnecting portions.

According to an embodiment of the invention, the step of forming thefirst electrode pads and conductive lines is after the step ofperforming the substrate patterning process. Moreover, the firstelectrode pads are formed on the cantilever portions, and the conductivelines are formed on the connecting portions.

According to an embodiment of the invention, the manufacturing method ofthe touch input device further includes: providing a base; and fixingthe substrate on the base.

According to an embodiment of the invention, the manufacturing method ofthe touch input device further includes: before fixing the substrate onthe base, forming a plurality of second electrode pads on the baserespectively corresponding to the first electrode pads.

In an embodiment of the invention, a touch detecting method includes:sensing a first electrical variation of different locations in thedirections parallel to a reference plane due to an object approaching ortouching the reference plane; sensing a second electrical variation dueto the object pressing the reference plane; according to the firstelectrical variation, determining a location in the directions parallelto the reference plane due to the object approaching or touching thereference plane; according to the second electrical variation,determining a degree of the object pressing the reference plane; andaccording to the location of the object in the directions parallel tothe reference plane due to the object approaching or touching thereference plane, and the degree of the object pressing the referenceplane, determining a three-dimensional touch location of the object.

According to an embodiment of the invention, the first electricalvariation is a capacitance variation, and the second electricalvariation is an electric field variation or a capacitance variation.

According to an embodiment of the invention, the touch detecting methodfurther includes using a carrying board to form the reference plane. Thecarrying board includes a plurality of cantilever portions and aplurality of connecting portions connecting the cantilever portions. Atleast one electrode pad is respectively disposed on the cantileverportions, in which when the object presses the reference plane, thepressed cantilever portion correspondingly deforms so that a variationis generated on the location of the first electrode pad on the pressedcantilever portion.

According to an embodiment of the invention, the step of sensing thesecond electrical variation due to the object pressing the referenceplane includes: correspondingly disposing at least one second electrodepad below the first electrode pads respectively; and sensing anelectrical variation of the second electrode pads, in which when thefirst electrode pad disposed on the cantilever portion approaches thecorresponding second electrode pad due to the object pressing thereference plane, an electrical property of the second electrode padchanges.

In the touch input device according to embodiments of the invention,since the carrying board has the cantilever portions, therefore, whenthe cantilever portions are pressed downwards, the cantilever portionsare curved downwards to allow the user to feel the press sensation.Moreover, in the touch input device according to embodiments of theinvention, since the depth sensing layer below the planar locationsensing board can sense the second electrical variation corresponding tothe degree in which the object presses the planar location sensingboard, therefore, the touch input device can detect the press depth ofthe object. In the manufacturing method of the touch input deviceaccording to embodiments of the invention, since a substrate patterningprocess is used to pattern a plurality of cantilever portions from thesubstrate, therefore, a touch input device capable of implementing thepress sensation can be manufactured. In the touch detecting methodaccording to embodiments of the invention, since the method includes thestep of determining the degree in which the object presses the referenceplane according to the electrical variation generated when the objectpresses the reference plane, therefore, the touch detecting method candetect the three-dimensional touch location of the object.

To make the above features and advantages of the invention morecomprehensible, several embodiments accompanied with drawings aredescribed in detail as follows.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings constituting a part of this specification areincorporated herein to provide a further understanding of thedisclosure. Here, the drawings illustrate embodiments of the disclosureand, together with the description, serve to explain the principles ofthe disclosure.

FIG. 1A is a perspective view of a touch input device according to anembodiment of the invention.

FIG. 1B is a partial cross-sectional view of the touch input devicealong an I-I line depicted in FIG. 1A.

FIG. 1C is a bottom view of the carrying board, the first electrodepads, and the conductive lines depicted in FIG. 1A.

FIG. 1D is a schematic view of the second electrode pads and a circuitconnecting the second electrode pads depicted in FIG. 1A.

FIG. 1E is a circuit block diagram of the touch input device depicted inFIG. 1A.

FIG. 2 is a partial cross-sectional view of a touch input deviceaccording to another embodiment of the invention.

FIG. 3 is a partial cross-sectional view of a touch input deviceaccording to another embodiment of the invention.

FIGS. 4A-4D are cross-sectional views of a manufacturing method of atouch input device according to an embodiment of the invention.

FIG. 5 is a perspective view of the carrying board depicted in FIG. 4A.

FIG. 6 is a cross-sectional view of a step of a manufacturing method ofa touch input device according to another embodiment of the invention.

FIG. 7 is a flow diagram illustrating a touch detecting method accordingto an embodiment of the invention.

DESCRIPTION OF EMBODIMENTS

FIG. 1A is a perspective view of a touch input device according to anembodiment of the invention. FIG. 1B is a partial cross-sectional viewof the touch input device along an I-I line depicted in FIG. 1A. FIG. 1Cis a bottom view of the carrying board, the first electrode pads, andthe conductive lines depicted in FIG. 1A. FIG. 1D is a schematic view ofthe second electrode pads and a circuit connecting the second electrodepads depicted in FIG. 1A. FIG. 1E is a circuit block diagram of thetouch input device depicted in FIG. 1A. With reference to FIG. 1A toFIG. 1E, a touch input device 100 of the present embodiment includes acarrying board 110, a plurality of first electrode pads 120, and aplurality of conductive lines 130. The carrying board 110 includes aplurality of cantilever portions 112 and a plurality of connectingportions 114, in which the connecting portions 114 are connected to thecantilever portions 112. In the present embodiment, a material of thecarrying board 110 may be transparent insulating materials such as glassor plastic, for instance. However, in other embodiments, the material ofthe carrying board 110 may also be opaque insulating materials.

The first electrode pads 120 are disposed on the cantilever portions112, and the first electrode pads 120 are configured to sense acapacitance variation due to an object 50 (shown in FIG. 1B) approachingor touching the carrying board 110. In the present embodiment, theobject 50 may be a finger of the user, a conductive stylus, or othersuitable conductive objects. The conductive lines 130 extend on theconnecting portions 114 and are respectively connected to the firstelectrode pads 120. In the present embodiment, the carrying board 110has a reference plane R (e.g., formed by a surface of the carrying board110 facing away from the first electrode pads 120). Moreover, anx-coordinate direction and a y-coordinate direction are defined as bothparallel to the reference plane R, and the x-coordinate direction andthe y-coordinate direction are perpendicular to each other. Theconnecting portions 114 respectively connect the cantilever portions112, so that each of the cantilever portions 112 may independently sag adistance in a z-coordinate direction relative to the reference plane Rwhen pressed by the object 50, in which the z-coordinate direction isperpendicular to the x-coordinate direction and the y-coordinatedirection. Furthermore, in the present embodiment, the first electrodepads 120 are respectively disposed on the cantilever portions 112. Thefirst electrode pads 120 are configured to sense a capacitance variationdue to the object 50 approaching or touching the carrying board 110 inorder to determine an x-coordinate value and a y-coordinate value of theobject 50 relative to the reference plane R.

In the present embodiment, the touch input device 100 further includes afirst interpretation unit 140 electrically connected to the conductivelines 130. The first interpretation unit 140 is configured to determinea location of the carrying board 110 in directions parallel to thecarrying board 110 approached or touched by the object 50, andaccordingly generate a corresponding first signal S1. For example, thefirst interpretation unit 140 determines the location of the carryingboard 110 relative to the reference plane R approached or touched by theobject 50, and accordingly generate the first signal S1 including thex-coordinate value and the y-coordinate value. In the presentembodiment, the first electrode pads 120 and the conductive lines 130are disposed on a side (e.g. bottom side) of the carrying board 110facing away from the object 50. Therefore, the object 50 does notdirectly contact the first electrode pads 120 and the conductive lines130. In the present embodiment, the first electrode pads 120 include aplurality of transmitting electrode pads 122 and a plurality of sensingelectrode pads 124 alternately arranged on the carrying board 110 andseparated from each other. The conductive lines 130 include at least onedriving signal line 132 (e.g., a plurality of driving signal lines 132in the present embodiment) connected to the transmitting electrode pads122, and at least one signal readout line 134 (e.g., a plurality ofsignal readout lines 134 in the present embodiment) connected to thesensing electrode pads 124. In the present embodiment, in each row offirst electrode pads 120, the transmitting electrode pads 122 areconnected to a same driving signal line 132, and this driving signal 132is connected to the first interpretation unit 140. The sensing electrodepads 124, on the other hand, is independently connected to the firstinterpretation unit 140 respectively through the signal readout lines134 respectively. However, in other embodiments, each of thetransmitting electrode pads 122 may be independently connected to thefirst interpretation unit 140 through a driving signal line 132respectively. In other embodiments, each row of sensing electrode pads124 may be commonly connected to a same signal readout line 134respectively, and each row of transmitting electrode pads 122 may becommonly connected to a same driving signal line 132 respectively. Inother words, according to a sensitivity requirement and whether amulti-touch function is included, a designer may flexibly design thesensing electrode pads 124 and the transmitting electrode pads 122 toindependently connect to the first interpretation unit 140 respectively,or to commonly connect to a same signal readout line 134 and a samedriving signal line 132 and then connect to the first erpretation unit140.

The first interpretation unit 140 may respectively transmit a pluralityof driving signals to the transmitting electrode pads 122, andrespectively receive the sensing signals from the sensing electrode pads124 through the signal readout lines 134. When the carrying board 110 isapproached or touched by the object 50, a mutual capacitance valuebetween the sensing electrode pads 124 near the object 50 and theneighboring transmitting electrode pads 122 changes, so that the sensingsignals generated by the sensing electrode pads 124 are varied.Therefore, the first interpretation unit 140 can determine a locationwhich the object 50 approaches or touches according to the sensingsignals transmitted by the sensing electrode pads 124. That is, alocation parallel to a direction of the carrying board 110, such as an(x, y) coordinate location on the x-direction and the y-direction. InFIGS. 1A to 1D, the x-direction, y-direction, and z-direction areperpendicular to each other, and the z-direction is perpendicular to thecarrying board 110. In other words, the carrying board 110, the firstelectrode pads 120, and the conductive lines 130 form a capacitive touchpanel, which may be also known as a planar location sensing board.However, in other embodiments, each of the first electrode pads 120 mayinclude a single electrode pad. Moreover, each of the single electrodepads may independently connect to the first interpretation unit 140through a conductive line 130 respectively. Alternatively, each of thesingle electrode pads connected by the conductive lines 130 may becommonly connected to a signal line and then electrically connected tothe first interpretation unit 140. That is, the first electrode pads 120in this single electrode pad mode sense a self-capacitance variationgenerated due to the object approaching or touching the carrying board110. In other words, the planar location sensing board senses a firstelectrical variation of different locations in the directions parallelto the planar location sensing board (i.e., directions parallel to thexy plane) due to the object 50 approaching or touching the planarlocation sensing board, in which the first electrical variation may be acapacitance variation, for instance. Moreover, the first interpretationunit 140 is electrically connected to the planar location sensing board.According to the first electrical variation, the first interpretationunit 140 determines the location in the directions parallel to theplanar location sensing board which the object 50 approaches or touchesthe planar location sensing board, and generates a corresponding firstsignal S1.

In the present embodiment, the first interpretation unit 140 may includean integrator, an analog-to-digital (A/D) converter, and a processor.The integrator may convert a sensing signal from the signal readoutlines 134 into an analog voltage signal. The A/D converter then convertsthe analog voltage signal into a digital voltage signal. According tothe digital voltage signals, the processor then calculates the locationwhich the object 50 touches or approaches the carrying board 110, suchas by calculating a touch or approached (x, y) coordinate, for example.In the present embodiment, the first interpretation unit 140 may beimplemented by an integrated circuit, for instance.

In the touch input device 100 of the present embodiment, since thecarrying board 110 has the cantilever portions 112, therefore, when thecantilever portions 112 are pressed downwards, the cantilever portions112 are curved downwards to allow the user to experience a presssensation. Accordingly, a touch input device with press sensation can beimplemented. Although the present embodiment used a cantilever model toexemplify the cantilever portions 112 in the figures, the invention isnot limited thereto. The scope of the cantilever portions 112 in theinvention is defined as any structure capable of partial deformationwhen pressed by an external force and having a flexible restorationforce for returning to an original state after the external force isremoved. In the present embodiment, a transmitting electrode pad 122 anda sensing electrode pad 124 are disposed on each of the cantileverportions 112. Therefore, the first interpretation unit 140 can determinewhich cantilever portion 112 the object 50 approached, touched, orpressed. Accordingly, the touch input device 100 may be used as aphysical keyboard, where each of the cantilever portions 122 may serveas a key on the physical keyboard. Moreover, letters, symbols, orcharacters may be printed on a surface of the cantilever portions 112(e.g., on a surface facing away from the first electrode pads 120, or ona surface facing towards the first electrode pads 120), to allow theuser to recognize the key function represented by the cantileverportions 112. However, in other embodiments, multiple pairs oftransmitting electrode pads 122 and sensing electrode pads 124 may bedisposed on each of the cantilever portions 112, or each of thecantilever portions 112 may include a plurality of single electrodepads.

In the present embodiment, the transmitting electrode pads 122 andsensing electrode pads 124 are disposed in parallel, such as disposed ona same plane that is parallel to the xy plane. However, in otherembodiments, the transmitting electrode pads 122 and sensing electrodepads 124 may also be disposed to be vertical, such as disposed along thez-direction. Moreover, an insulator layer may be disposed between thetransmitting electrode pads 122 and sensing electrode pads 124 toseparate the transmitting electrode pads 122 and sensing electrode pads124.

In the present embodiment, the touch input device 100 further includes abase 150, and the carrying board 110 further includes an outer frame116. The cantilever portions 112 are fixed on the outer frame 116through the connecting portions 114, and the outer frame 116 is fixed onthe base 150. For example, the outer frame 116 may be bonded on the base150 by an adhesive or a rectangular-ring-shaped tape. In the presentembodiment, the base 150 has a grating structure 152. The gratingstructure 152 has a plurality of openings 151 correspondingly locatedbelow the cantilever portions 112 respectively. When the user looks at aspace G between two neighboring cantilever portions 112, the gratingstructure 152 allows the user to not perceive the area underneath ashollow, so that the cantilever portions 112 move in the openings 151when being pressed. However, in other embodiments, the base 150 may notinclude the grating structure 152, such that the base 150 is formed by aflat base plate 156 and a frame 154.

In the present embodiment, the touch input device 100 further includes aplurality of second electrode pads 160 correspondingly disposed belowthe cantilever portions 112 respectively and separated by a distanceaway from the cantilever portions 112. In the present embodiment, thesecond electrode pads 160 are disposed on the base 150 and respectivelycorrespond to the first electrode pads 120 above. Moreover, a separationspace or a filling of insulated elastic material exists between thefirst electrode pads 120 and the corresponding second electrode pads160. The separation space is depicted in FIG. 1B as an illustrativeexample. When any one of the cantilever portions 112 is pressed by theobject 50 and sags towards the corresponding second electrode pad 160along the z-coordinate direction, the second electrode pad 160 generatesa variation in an electrical signal S0 in respond to the sagging of thecorresponding first electrode 120.

In specifics, when the cantilever portions 112 are pressed so that thefirst electrode pads 120 approach the second electrode pads 160, amagnitude of an electric field formed on the second electrode pads 160by the electric charge on the first electrode pads 120 is increased.Accordingly, the second electrode pads 160 generate changes to thecurrent signals or voltage signals. In other words, the electricalsignal S0 may be a current signal or a voltage signal. Alternatively,when the cantilever portions 112 are pressed so that the first electrodepads 120 approach the second electrode pads, a capacitance (e.g.self-capacitance) corresponding to the second electrode pads 160changes, such that the electrical signal S0 (e.g. current signal orvoltage signal) generated by the second electrode pads 160 changes.

In the present embodiment, the touch input device 100 further includes asecond interpretation unit 170 electrically connected to the secondelectrode pads 160. The second interpretation unit 170 determines a saglevel of the cantilever portions 112 pressed by the object 50, andaccordingly generate a corresponding second signal S2, such as a secondsignal S2 including a z-coordinate value, for example. To be specific,in the present embodiment, the second electrode pads 160 are connectedto the second interpretation unit 170 by a plurality of conductive lines180, so as to transmit the electrical signal S0 generated by the secondelectrode pads 160 to the second interpretation unit 170. Moreover, thesecond interpretation unit 170 may drive all of the second electrodepads 160 with a single driving signal, thereby simplifying the frameworkof the second interpretation unit 170. For example, the second electrodepads 160 may be electrically connected to a same driving signal line,and the second interpretation unit 170 transmits the driving signal tothe second electrode pads 160 through the driving signal line. However,in other embodiments, different rows of the second electrode pads 160may be connected to the second interpretation unit 170 through aplurality of different driving signal lines, respectively.Alternatively, different second electrode pads 160 may be connected tothe second interpretation unit 170 through different driving signallines, respectively.

According to a variation of the electrical signal S0, the secondinterpretation unit 170 calculates a depth of a press on the cantileverportions 120; that is, a location corresponding to a z-coordinate valueof the press is calculated. In the present embodiment, the secondinterpretation unit 170 may include an integrator, an A/D converter, anda processor. The integrator may convert the signal S0 of the secondelectrode pads 160 into an analog voltage signal. The A/D converter thenconverts the analog voltage signal into a digital voltage signal.According to the digital voltage signals, the processor then calculatesa depth location of the press by the object 50 on the cantileverportions 112, such as by calculating a location corresponding to az-coordinate value of the press on the cantilever portions 112, forexample. In the present embodiment, the second interpretation unit 170may be implemented by an integrated circuit, for instance.

In other words, the second electrode pads 160, the conductive lines 180,and the driving signal lines connected with the second electrode pads160 may form a depth sensing layer disposed below the planar locationsensing board, and the depth sensing layer is separated from the planarlocation sensing board by a distance. The depth sensing layer isconfigured to sense a second electrical variation corresponding to adegree in which the object 50 presses the planar location sensing board,where the second electrical variation is an electric field variation ora capacitance variation. Moreover, the second interpretation unit 170 iselectrically connected to the depth sensing layer, and the secondinterpretation unit 170 determines the degree the object 50 presses theplanar location sensing board according to the second electricalvariation, and accordingly generates a corresponding second signal S2.In other words, the first electrode pads 120 senses the first electricalvariation generated when the object 50 approaches or touches the planarlocation sensing board, and the second electrode pads 160 senses thesecond electrical variation generated with the corresponding firstelectrode pads 120 when the object 50 presses the cantilever portions112 above the planar location sensing board.

In the present embodiment, the touch input device 100 further includes aprocessing unit 190 determining a three-dimensional touch location ofthe object 50 according to the first signal S1 and the second signal S2.For example, the first interpretation unit 140 transmits the firstsignal S1 representing an (x, y) coordinate value to the processing unit190, and second interpretation unit 170 transmits the second signal S2representing a z-coordinate value to the processing unit 190. Theprocessing unit 190 may assemble the first signal S1 and the secondsignal S2 into a three-dimensional touch location which the cantileverportions 112 have been pressed to each time; that is, a (x, y, z)coordinate value. Since the touch input device 100 of the presentembodiment can determine the three-dimensional touch location that thetouch input device 100 has been pressed to, the applicability of thetouch input device 100 is enhanced. For example, the z-coordinate valuemay correspond to the force of the press. Therefore, a software designermay develop application programs which utilize the press force, therebyenhancing the functions and variety of the application programs. In thepresent embodiment, the processing unit 190 may be implemented byfirmware, although the invention is not limited thereto. In otherembodiments, the processing unit 190 may also be a digital logic circuit(i.e hardware implemented) or a computer central processor (i.e.,software implemented).

FIG. 2 is a partial cross-sectional view of a touch input deviceaccording to another embodiment of the invention. Referring to FIG. 2, atouch input device 100 a of the present embodiment is similar to thetouch input device 100 depicted in FIG. 1B, and the difference betweenthese two devices are described below. In the present embodiment, thetouch input device 100 a further includes an insulating material 210filling a space (e.g. space G) between every two neighboring cantileverportions 112. Moreover, in the present embodiment, the insulatingmaterial 210 further fills between the first electrode pads 120 and thesecond electrode pads 160, and the insulating material 210 may be anelastic material, for instance. Therefore, when the cantilever portions112 are pressed, a portion of the insulating material 210 locatedbetween the first electrode pads 120 and the second electrode pads 160is compressed, and the insulating material 210 near the pressedcantilever portions 112 also sags accordingly. The insulating material210 may be a transparent material, for example, and a refractive indexthereof may be close to a refractive index of the carrying board 110,making it difficult for the user to discern the space G. Furthermore,the base 150 may also be formed by a transparent material, and the firstelectrode pads 120 and the second electrode pads 160 may be formed by atransparent conductive material (e.g. indium tin oxide). Accordingly,the touch input device 100 a may be made to be transparent, and suitablefor configuration above a display region of a display device, such thatthe user can operate according to the graphics or content displayed inthe display region.

In another embodiment, the insulating material 210 may also be disposedin the space G, but not between the first electrode pads 120 and thesecond electrode pads 160. In other words, air, gas, liquid, or aspacing may exist between the first electrode pads 120 and the secondelectrode pads 160. Alternatively, the insulating material 210 may onlybe disposed between the first electrode pads 120 and the secondelectrode pads 160, but not in the space G. In other words, air, gas,liquid, or a spacing may exist in the space G. Alternatively, aninsulating material disposed in the space G and an insulating materialdisposed between the first electrode pads 120 and the second electrodepads 160 may be different insulating materials.

FIG. 3 is a partial cross-sectional view of a touch input deviceaccording to another embodiment of the invention. With reference to FIG.3, a touch input device 100 b of the present embodiment is similar tothe touch input device 100 depicted in FIG. 1B, and the differencebetween these two devices are described below. The touch input device100 b of the present embodiment further includes an insulating layer 220disposed on a base 150 b and located between each of the secondelectrode pads 160 and the base 150 b, in which a material of the base150 b include a metal, for instance. Accordingly, the conductive base150 b does not affect the electrical property of the second electrodepads 160.

FIGS. 4A-4D are cross-sectional views of a manufacturing method of atouch input device according to an embodiment of the invention. FIG. 5is a perspective view of the carrying board depicted in FIG. 4A. Withreference to FIGS. 4A-4D, a manufacturing method of a touch input deviceaccording to the present embodiment may fabricate the touch input device100 of FIGS. 1A and 1B, or the touch input devices of the otherembodiments. The manufacture of the touch input device 100 depicted inFIG. 2 is used as an illustrative example below. The manufacturingmethod of the touch input device according to the present embodimentincludes the following steps. With reference to FIG. 4A, a substrate isprovided, in which the substrate may be a glass substrate, a plasticsubstrate, or substrates of other insulating materials. Thereafter, asubstrate patterning process is performed in order to pattern aplurality of cantilever portions 112 and a plurality of connectingportions 114 from the substrate (as shown in FIG. 5) and form thecarrying board 110, in which the connecting portions 114 are connectedto the cantilever portions 112. In the present embodiment, the substratepatterning process further patterns the outer frame 116 from thesubstrate. The substrate patterning process may be a physical cuttingprocess (e.g. wheel or knife cutting process or laser cutting process),or a chemical patterning process (e.g. etching process). Thereafter, asshown in FIG. 4B, a plurality of first electrode pads 120 and aplurality of conductive lines 130 (shown in FIG. 1C) are formed on thesubstrate (e.g. carrying board 110).

In the present embodiment, the step of forming the first electrode pads120 and conductive lines 130 is after the step of performing thesubstrate patterning process. Moreover, the first electrode pads 120 areformed on the cantilever portions 112, and the conductive lines 130 areformed on the connecting portions 114.

As shown in FIG. 4C, the base 150 is then provided. Thereafter, aplurality of second electrode pads 160, the conductive lines 180 of theembodiment depicted in FIG. 1D, and the driving signal lines are formedon the base 150. In another embodiment, when the material of the base150 b (shown in FIG. 3) is a metal, the insulating layer 220 may befirst formed on the base 150 b, and then the second electrode pads 160,the conductive lines 180, and the driving signal lines are formed on theinsulating layer 220.

As shown in FIG. 4D, the substrate (e.g. carrying board 110) is fixed onthe base 150. In the present embodiment, the step of fixing thesubstrate (e.g. carrying board 110) on the base 150 includes separatingall the first electrode pads 120 and the second electrode pads 160 sothey correspond to each other. Alternatively, as shown in the embodimentof FIG. 1A, the cantilever portions 112 are respectively aligned withthe openings 151 of the grating structure 152, and then the outer frame116 is bonded on the base 150, such as by using an adhesive or arectangular-ring-shaped tape to bond the outer frame 116 on the frame154 of the base 150. Up to this point, the fabrication of the touchinput device 100 is completed. The manufacturing method of the touchinput device in the present embodiment can fabricate the touch inputdevice 100 or the touch input devices in other embodiments that arecapable of implementing the press sensation.

FIG. 6 is a cross-sectional view of a step of a manufacturing method ofa touch input device according to another embodiment of the invention.With reference to FIGS. 4A-4D and FIG. 6, a manufacturing method of atouch input device of the present embodiment is similar to themanufacturing method of the touch input device depicted in FIGS. 4A-4D,and the difference between these two methods are described below. In thepresent embodiment, as shown in FIG. 6, the step of forming the firstelectrode pads 120 and the conductive lines 130 (shown in FIG. 1C) on asubstrate 110′ is before the step of performing the substrate patterningprocess. In other words, the substrate patterning process is performedafter forming the first electrode pads 120 and the conductive lines 130(shown in FIG. 1C) on the planar substrate 110′, so as to form thecarrying board 110 depicted in FIG. 4B. Thereafter, the steps depictedin FIGS. 4C and 4D are likewise performed to complete the fabrication ofthe touch input device 100. Furthermore, in the present embodiment,after the substrate patterning process is performed, the first electrodepads 120 are located on the cantilever portions 112, and the conductivelines 130 are located on the connecting portions 114 (shown in FIG. 1C).

FIG. 7 is a flow diagram illustrating a touch detecting method accordingto an embodiment of the invention. With reference to FIGS. 1B-1D andFIG. 7, a touch detecting method in the present embodiment may beexecuted by the touch input device 100 or the touch input devices of theother embodiments. The touch input device 100 is used as an illustrativeexample below. The touch detecting method includes Steps S110, S120,S130, and S140. In Step S110, a first electrical variation of differentlocations in the directions parallel to the reference plane R (e.g., inthe directions parallel to the xy plane) is sensed due to the object 50approaching or touching the reference plane R. In other words, thecarrying board 110 may be used to form the reference plane R. Moreover,when the object 50 presses the reference plane R, the pressed cantileverportions correspondingly deform (e.g. become curved), such that thelocations of the electrode pads disposed thereon are changed (e.g. thelocations sagged). The detailed description of the first electricalvariation may be referenced to the embodiment depicted by FIGS. 1A-1D.In the present embodiment, Step S110 may be implemented by the planarlocation sensing board (e.g., including the carrying board 110, thefirst electrode pads 120, and the conductive lines 130), the details ofwhich may be referenced to the afore-described embodiments and notrepeated herein.

In Step S120, a second electrical variation due to the object 50pressing the reference plane R is sensed. Step S120 may includecorrespondingly disposing at least one second electrode pad 160 (e.g., aplurality of second electrode pads 160 in the present embodiment)respectively below the first electrode pads 120, and sensing theelectrical variations of the second electrode pads 160. When the object50 presses the reference plane R, such that the first electrode pads 120disposed on the pressed cantilever portions 112 approach thecorresponding second electrode pads 160, the electrical properties ofthe second electrode pads 160 change. In the present embodiment, StepS120 may be implemented by the depth sensing layer (e.g., including thesecond electrode pads 160, the driving signal lines, and the conductivelines 180 connected to the second electrode pads 160), the details ofwhich may be referenced to the afore-described embodiments and notrepeated herein.

In Step S130, according to the first electrical variation, a location(e.g. (x, y) coordinate value) in the directions parallel to thereference plane R due to the object 50 approaching or touching thereference plane R is determined. Step S130 may be executed by the firstinterpretation unit 140, the details of which may be referenced to theafore-described embodiments and not repeated herein.

In Step S140, according to the second electrical variation, a degree inwhich the object 50 presses the reference plane R is determined (e.g.,by obtaining the z-coordinate value). Step S140 may be executed by thesecond interpretation unit 170, the details of which may be referencedto the afore-described embodiments and not repeated herein.

The afore-described Steps S110-S140 may be executed in any suitablesequence or executed simultaneously. Moreover, the sub-steps of theafore-described Steps S110-S140 may also be executed in any suitablesequence or executed simultaneously. According to the results obtainedfrom executing Steps S110-S140, Step S150 may be subsequently executed.In Step S150, according to the location (e.g. (x, y) coordinate value)in the directions parallel to the reference plane R due to the object 50approaching or touching the reference plane R, and the degree in whichthe object 50 presses the reference plane R (e.g. z-coordinate value), athree-dimensional touch location of the object 50 (e.g. (x, y, z)coordinate value) is determined. Step S150 may be executed by theprocessing unit 190, the details of which may be referenced to theafore-described embodiments and not repeated herein. In addition, StepsS110-S150 may be continuously and repeatedly executed, such thatreal-time touch sensing is achieved.

In the touch detecting method of the present embodiment, since themethod includes the step of determining the degree in which the object50 presses the reference plane R according to the electrical variationdue to the object 50 pressing the reference plane R, therefore, thetouch detecting method can detect the three-dimensional touch locationof the object 50, thereby enhancing the touch function and itsapplicability.

In view of the foregoing, in the touch input device according toembodiments of the invention, since the carrying board has thecantilever portions, therefore, when the cantilever portions are presseddownwards, the cantilever portions 112 are curved downwards to allow theuser to feel the press sensation. Moreover, in the touch input deviceaccording to embodiments of the invention, since the depth sensing layerbelow the planar location sensing board can sense the second electricalvariation corresponding to the degree in which the object presses theplanar location sensing board, therefore, the touch input device candetect the press depth of the object. In the manufacturing method of thetouch input device according to embodiments of the invention, since asubstrate patterning process is used to pattern a plurality ofcantilever portions from the substrate, therefore, a touch input devicecapable of implementing the press sensation can be manufactured. In thetouch detecting method according to embodiments of the invention, sincethe method includes the step of determining the degree in which theobject presses the reference plane according to the electrical variationgenerated when the object presses the reference plane, therefore, thetouch detecting method can detect the three-dimensional touch locationof the object.

Although the invention has been described with reference to the aboveembodiments, it will be apparent to one of ordinary skill in the artthat modifications to the described embodiments may be made withoutdeparting from the spirit of the invention. Accordingly, the scope ofthe invention will be defined by the attached claims and not by theabove detailed descriptions.

What is claimed is:
 1. A touch input device, comprising: a carryingboard having a reference plane, the carrying board defining anx-coordinate direction and a y-coordinate direction both parallel to thereference plane and perpendicular to each other, the carrying boardcomprising: a plurality of cantilever portions; and a plurality ofconnecting portions respectively connecting the cantilever portions, sothat each of the cantilever portions independently sags a distance in az-coordinate direction relative to the reference plane when pressed byan object, wherein the z-coordinate direction is perpendicular to thex-coordinate direction and the y-coordinate direction; a plurality offirst electrode pads respectively disposed on the cantilever portions,configured to sense a capacitance variation due to the objectapproaching or touching the carrying board in order to determine anx-coordinate value and a y-coordinate value of the object relative tothe reference plane; and a plurality of conductive lines extending onthe connecting portions and respectively connected to the firstelectrode pads.
 2. The touch input device according to claim 1, furthercomprising a base, wherein the carrying board further comprises an outerframe, the cantilever portions are fixed on the outer frame through theconnecting portions, and the outer frame is fixed on the base.
 3. Thetouch input device according to claim 2, wherein the base has a gratingstructure having a plurality of openings correspondingly located belowthe cantilever portions respectively.
 4. The touch input deviceaccording to claim 1, further comprising a plurality of second electrodepads correspondingly disposed below the cantilever portions respectivelyand separated by a distance away from the cantilever portions, whereinwhen any one of the cantilever portions is pressed by the object andsags towards the corresponding second electrode pad along thez-coordinate direction, the second electrode pad generates a variationin an electrical signal in respond to the sagging of the correspondingfirst electrode.
 5. The touch input device according to claim 4, furthercomprising a base, wherein the carrying board is fixed on the base, thesecond electrode pads are disposed on the base to correspond to thefirst electrode pads, and a separation space or a filling of insulatedelastic material exists between the first electrode pads and thecorresponding second electrode pads.
 6. The touch input device accordingto claim 5, further comprising an insulating layer disposed on a baseand located between each of the second electrode pads and the base,wherein a material of the base comprises a metal.
 7. The touch inputdevice according to claim 4, further comprising: a first interpretationunit electrically connected to the conductive lines, the firstinterpretation unit determining a location of the object relative to thereference plane due to the object approaching or touching the carryingboard, and generating a first signal comprising the x-coordinate valueand the y-coordinate value; a second interpretation unit electricallyconnected to the second electrode pads, the second interpretation unitdetermining a degree in which the object presses the cantileverportions, and generating a second signal comprising the z-coordinatevalue; and a processing unit determining a three-dimensional touchlocation of the object according to the first signal and the secondsignal.
 8. The touch input device according to claim 1, furthercomprising an insulating material filling a space between every twoneighboring cantilever portions.
 9. The touch input device according toclaim 1, wherein the first electrode pads comprise a plurality oftransmitting electrode pads and a plurality of sensing electrode padsalternately arranged on the carrying board and separated from eachother, the conductive lines comprising at least one driving signal lineconnected to the transmitting electrode pads, and at least one signalreadout line connected to the sensing electrode pads.
 10. The touchinput device according to claim 9, wherein the conductive lines comprisea plurality of driving signal lines each independently connected to thetransmitting electrode pads, or a single driving single line commonlyconnected to a plurality of the transmitting electrode pads, and theconductive lines comprise a plurality of signal readout lines eachindependently connected to the sensing electrode pads, or a singlesignal readout line commonly connected to a plurality of the sensingelectrode pads.
 11. The touch input device according to claim 1, whereinthe first electrode pads comprise a plurality of independent singleelectrode pads, and each of the single electrode pads is respectivelyconnected to one of the conductive lines, or a plurality of singleelectrode pads are commonly connected to one of the conductive lines.12. A touch input device, comprising: a planar location sensing boardsensing a first electrical variation of different locations in thedirections parallel to the planar location sensing board due to anobject approaching or touching the planar location sensing board; adepth sensing layer disposed below the planar location sensing board andseparated by a distance from the planar location sensing board, thedepth sensing layer sensing a second electrical variation correspondingto a degree in which the object presses the planar location sensingboard; a first interpretation unit electrically connected to the planarlocation sensing board, the first interpretation unit determining alocation in the directions parallel to the planar location sensing boardwhich the object approaches or touches the planar location sensing boardaccording to the first electrical variation, and generating acorresponding first signal; a second interpretation unit electricallyconnected to the depth sensing layer, the second interpretation unitdetermining the degree the object presses the planar location sensingboard according to the second electrical variation, and generating acorresponding second signal; and a processing unit determining athree-dimensional touch location of the object according to the firstsignal and the second signal.
 13. The touch input device according toclaim 12, wherein the first electrical variation is a capacitancevariation, and the second electrical variation is an electric fieldvariation or a capacitance variation.
 14. The touch input deviceaccording to claim 13, wherein the planar location sensing boardcomprises a plurality of cantilever portions and a plurality of firstelectrode pads disposed on the cantilever portions, and the depthsensing layer comprising a plurality of second electrode padscorresponding to the first electrode pads; wherein the first electrodepads sense the first electrical variation due to the object approachingor touching the planar location sensing board, and the second electrodepads sense the second electrical variation due to the object pressingthe cantilever portion on the planar location sensing board and betweenthe pressed cantilever portion and the corresponding first electrodepad.
 15. A manufacturing method of a touch input device, comprising:providing a substrate; forming a plurality of first electrode pads and aplurality of conductive lines on the substrate; and performing asubstrate patterning process in order to pattern a plurality ofcantilever portions and a plurality of connecting portions from thesubstrate, wherein the connecting portions connect the cantileverportions.
 16. The manufacturing method of the touch input deviceaccording to claim 15, wherein the step of forming the first electrodepads and the conductive lines on the substrate is performed before thestep of the substrate patterning process, and after performing thesubstrate patterning process, the first electrode pads are located onthe cantilever portions, and the conductive lines are located on theconnecting portions.
 17. The manufacturing method of the touch inputdevice according to claim 15, wherein the step of fon ring the firstelectrode pads and the conductive lines on the substrate is performedafter the step of the substrate patterning process, and the firstelectrode pads are formed on the cantilever portions, and the conductivelines are formed on the connecting portions.
 18. The manufacturingmethod of the touch input device according to claim 15, furthercomprising:providing a base; and fixing the substrate on the base. 19.The manufacturing method of the touch input device according to claim18, wherein the substrate patterning process further patterns an outerframe from the substrate, and the step of fixing the substrate on thebase comprises bonding the outer frame on the base.
 20. Themanufacturing method of the touch input device according to claim 18,further comprising: before fixing the substrate on the base, forming aplurality of second electrode pads on the base respectivelycorresponding to the first electrode pads.
 21. The manufacturing methodof the touch input device according to claim 20, further comprising:before forming the second electrode pads on the base, forming aninsulating layer on the base, wherein the second electrode pads areformed on the insulating layer, and a material of the base is a metal.22. The manufacturing method of the touch input device according toclaim 18, wherein the base has a grating structure having a plurality ofopenings, and the step of fixing the substrate on the base comprisesrespectively aligning the cantilever portions with the openings.
 23. Atouch detecting method, comprising: sensing a first electrical variationof different locations in the directions parallel to a reference planedue to an object approaching or touching the reference plane; sensing asecond electrical variation due to the object pressing the referenceplane; according to the first electrical variation, determining alocation in the directions parallel to the reference plane due to theobject approaching or touching the reference plane; according to thesecond electrical variation, determining a degree of the object pressingthe reference plane; and according to the location of the object in thedirections parallel to the reference plane due to the object approachingor touching the reference plane, and the degree of the object pressingthe reference plane, determining a three-dimensional touch location ofthe object.
 24. The touch detecting method according to claim 23,wherein the first electrical variation is a capacitance variation, andthe second electrical variation is an electric field variation or acapacitance variation.
 25. The touch detecting method according to claim23, further comprising using a carrying board to form the referenceplane, the carrying board comprising a plurality of cantilever portionsand a plurality of connecting portions connecting the cantileverportions, at least one electrode pad being respectively disposed on thecantilever portions, wherein when the object presses the referenceplane, the pressed cantilever portion correspondingly deforms so that avariation is generated on the location of the first electrode pad on thepressed cantilever portion.
 26. The touch detecting method according toclaim 25, wherein the step of sensing the second electrical variationdue to the object pressing the reference plane comprises:correspondingly disposing at least one second electrode pad below thefirst electrode pads respectively; and sensing an electrical variationof the at least one second electrode pad, wherein when the firstelectrode pad disposed on the cantilever portion approaches thecorresponding second electrode pad due to the object pressing thereference plane, an electrical property of the second electrode padchanges.